Tech•
TSMC Event Highlights AI and Chiplet Design Advances
TSMC's OIP Forum 2025 highlighted key advancements in AI and chiplet design, with partners Cadence, Siemens, and Synopsys revealing new tools for advanced nodes.
Liam Kendrick
Liam Kendrick is a technology correspondent for Neurozzio specializing in enterprise data storage, data center architecture, and the semiconductor industry. He reports on emerging hardware standards and their impact on cloud computing and AI infrastructure.
6 Articles
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Joined September 2025
Languages
English
Areas of Expertise
Data Center TechnologyEnterprise StorageSemiconductorsAI Infrastructure
Latest Articles by Liam Kendrick
AI•
Equinix Unveils Distributed AI Infrastructure Platform
Equinix has launched a new Distributed AI infrastructure platform to support advanced AI workloads, featuring a global network, an AI Solutions Lab, and new automation tools.
AI•
Stargate AI Project Adds Five US Data Centers
OpenAI, Oracle, and SoftBank are expanding the Stargate AI project with five new U.S. data centers, bringing total investment to over $400 billion.
AI•
NVIDIA and OpenAI Announce Landmark AI Infrastructure Deal
NVIDIA and OpenAI have announced a strategic partnership to deploy 10 gigawatts of AI computing power, backed by a potential $100 billion investment from NVIDIA.
AI•
Apple Details AI Strategy with New In-House Chip Designs
Apple executives detail how new in-house chips, like the A19 Pro with GPU neural accelerators, are foundational to its on-device AI and efficiency strategy.
AI•
New AI Storage Standards Aim to Boost Efficiency
The Storage Networking Industry Association (SNIA) has launched Storage.AI, a new initiative to create open standards for managing AI data more efficiently.